Physware, Inc., a provider of high-speed 3D field solutions for the high-frequency package and board markets, recently announced that Madrona Venture Group and WRF Capital have collectively invested $2.5 million in venture funding. The company announced that the series A funding will enable Physware to accelerate product development and global expansion.

Founded in June 2006 by Dr. Vikram Jandhyala, Physware develops technology that significantly enhances advanced package and board-level electrical modeling and design. The company’s patent-pending, physics-aware technology enables improved productivity and efficiency at every step of the design cycle, significantly reducing time to market.

“This funding represents a tremendous vote of confidence in Physware’s revolutionary technology, which originated at the Applied Computational Engineering (ACE) lab at the University of Washington (UW),” said Professor Jandhyala. “Madrona Venture Group and WRF Capital have supported multiple successful technology companies originating from the UW, and we are delighted to have them as part of our team.”

“What excited us most about Physware is that its technology is not just a little bit better, a little bit faster,” said Greg Gottesman, Managing Director of Madrona. “Physware’s solution offers orders of magnitude improvement in speed without sacrificing accuracy. We use the term ‘disruptive technology’ too much in the venture business. This really is disruptive technology.”

Gottesman and fellow Madrona Managing Director Tom Alberg sit on the board with Physware chairman and CEO Dr. Jandhyala and Physware president and COO, Bala Vishwanath.

“We are excited to work with this team,” said Alberg. “Vikram is that rare combination of technical genius and business leader, and Bala brings a solid history of execution in the EDA space. They’ve also assembled an incredible group of developers who have built a product that we think will change the EDA market landscape.”

Physware, Inc. develops high-speed field solutions for signal and power issues in high-frequency package and board-level electrical modeling and design for the microelectronics industry. The company’s patent-pending, physics-aware technology tightly couples analysis and design methods to the underlying Maxwell’s and circuit equations, enabling robustness and efficiency at every step of the design cycle and significantly reducing time to market. Physware’s accelerated technology delivers unprecedented capacity, handling in package and board simulations, significantly faster speed than current methodologies, and the ability to span the entire design cycle while maintaining concurrent, uncompromising Maxwell accuracy.

Physware is a venture-backed, privately-held company led by an experienced management and advisory team. The technology is based on multiple patent-pending methodologies, over one hundred publications, several PhD theses, and significant research funding by DARPA, NSF and industry leaders.

For more information, please visit www.physware.com