Tela Innovations, an early stage technology company focused on addressing the challenges of scaling semiconductor manufacturing to 45nm and beyond, recently announced that Intel Capital, the global investment arm of Intel Corporation, became a new investor in the company. Intel Capital's investment was part of the company's Series B round, which included new investor AsiaTech Management as well as existing investors.

The company further announced that the Series B capital will be used to bring to market Tela's technology for enabling a more efficient and reliable way to design and manufacture next generation chips. Tela publicly unveiled the details of its strategy and technology for the first time this week.

"The need for new scaling techniques in the semiconductor manufacturing industry is significant," said Sean Doyle, director at Intel Capital. "Tela Innovations is addressing challenges in semiconductor design and manufacturing for companies working at leading edge process geometries."

"We are extremely pleased to have Intel Capital as an investor. Intel Capital's 'value beyond equity' approach will be advantageous to us in bringing our technology to market in 2008," said Scott Becker, co-founder, president and CEO of Tela.

Tela specifically addresses the limitations of current design and lithography approaches that stand in the way of continued scaling of semiconductor processes. Its approach uses pre-defined physical topologies, applicable for use in logic, embedded memory, analog and I/O functions that when synthesized and routed results in a lithography optimized layout.

Tela develops technology for addressing the challenge of scaling semiconductor design and manufacturing to next generation process geometries, such as 45nm and 32nm. Its solution uses gridded, straight line, one dimensional layout structures to provide a more efficient and reliable way to implement next generation chips. Tela's pre-defined physical topologies are applicable for use in logic, embedded memory, analog and I/O. The solution provides improvements in variability, performance, leakage and area without significant impact on existing design methodologies, equipment sets or process technologies. Tela is financed by Sand Hill Finance Company, Teton Capital Company, Intel Capital, AsiaTech Investment and Western Technology Investment. The company is headquartered in Campbell, California.

For more information, please visit www.tela-inc.com